FC-PGA - definição. O que é FC-PGA. Significado, conceito
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O que (quem) é FC-PGA - definição

TYPE OF INTEGRATED CIRCUIT PACKAGING. IN A PGA, THE PACKAGE IS SQUARE OR RECTANGULAR, AND THE PINS ARE ARRANGED IN A REGULAR ARRAY ON THE UNDERSIDE OF THE PACKAGE
SPGA; PPGA; FCPGA; Staggered pin grid array; Flip-chip pin grid array; Ceramic pin grid array; Plastic grid array; FC-PGA; Ceramic Pin Grid Array; Organic pin grid array; Opga; Organic Pin Grid Array; Pin Grid Array; Pin grid; OPGA; Stud grid array; Stud Grid Array; Polymer Stud Grid Array; Plastic Stud Grid Array; Staggered Pin Grid Array
  • Underside of an 80486 with lid removed shows die and wire bonded connections
  • AMD 754]])
  • Closeup of the pins of a pin grid array
  • AM2+ socket]]
  • View of the socket 7 321-pin connectors of a CPU
  • Underside of a [[Pentium 4]] in a PGA package
  • The underside of a FC-PGA package (the die is on the other side)
  • An example of a socket for a staggered pin grid array package
  • The topside of a [[Celeron]]-400 in a PPGA packing
  • The pin grid array at the bottom of a XC68020, a prototype of the [[Motorola 68020]] microprocessor

FC-PGA         
PGA Tour (video game series)         
SERIES OF GOLF VIDEO GAMES
Tiger Wood's PGA Tour 2005; PGA European Tour (video game); Tiger woods pga tour; PGA Tour® Golf; PGA European Tour (computer game); Tiger Woods PGA Tour (video game); Tiger Woods PGA Tour (iPhone OS); PGA Tour Golf: Tournament Course Disk; PGA European Tour (1994 video game); Tiger Woods PGA Tour Online; Tiger Woods PGA Tour (iPhone video game); PGA Tour series; Tiger Woods PGA Tour; PGA Tour (series); PGA Tour Pro
PGA Tour is a series of golf video games developed and published by Electronic Arts - and later their EA Sports sub-label - since 1990. The series primarily features courses featured on the U.
SPGA         

Wikipédia

Pin grid array

A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package.

PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP).